Cold mounting materials are used to encapsulate samples that cannot withstand the heat and pressure of compression mounting, when better flow and penetration of mounting material is needed or when a large quantity of samples must be encapsulated at once.
Quick set is used to encapsulated a wide variety of metallo-graphic specimens, especially printed circuit boards and other electronic components.
Cure time: 6-8 minutes
Hardness: 84 Shore D
Excellent hole penetration on PCB's
Low shrinkage improves adhesion
Methyl Acrylate Resins €“ Powder & Liquid
1x 400 gms Powder & 1x 400 ml Liquid
10 years from the date of Manufacturing.